1) encapsulated layer
封装层
2) operating system encapsulated layer
操作系统封装层
3) extending TCP/IP stack
TCP/IP协议栈封装层
4) Packaging
封装
1.
State-of-art in Simulation of Brazing Packaging for Miniaturized Multi-channel Heat Exchanger;
微小型多通道换热器钎焊封装仿真研究现状
2.
Thermal Conductive High Performance Polymer Microelectronic Packaging Material(Ⅰ):Preparation of the Packaging Material;
导热型高性能树脂微电子封装材料之一:封装材料的制备
5) encapsulation
封装
1.
Encapsulation and Catalytic Activity of Lipophilic Soluble Metallophthalocyanine Derivative in MCM-41;
脂溶性金属酞菁衍生物在介孔分子筛中的封装及其催化性质研究
2.
The Encapsulation and Application of Workflow System in Manufacturing Grid;
制造网格环境下工作流系统的封装和应用
3.
Portalet-based encapsulation for CAx software;
基于Portalet的CAx软件封装研究
6) Package
封装
1.
Simulation on temperature Held and materials optimization of high-power white LED package;
大功率白光LED封装温度场模拟及材料优化
2.
CMOS thermal wind sensor and its package;
CMOS工艺实现的热风速传感器及其封装
3.
Finite element based solder joint fatigue life predictions for a same die stacked chip scale ball grid array package;
芯片叠层球栅阵列尺寸封装的焊球疲劳寿命预测
参考词条
补充资料：层层加码
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