1) Bump processing
焊料凸点技术
2) Solder bump
焊料凸点
1.
In this paper, a low cost flip chip interconnection is introduced, which electrolessNi as the under bump metallurgy (UBM), deposits solder paste using stencil printing, and reflowsthe paste to form solder bumps.
回顾了低成本制备芯片上焊料凸点的方法,即化学镀镍制备凸点下金属层、模版印刷焊料,最后回流形成焊料凸点,并综述了该方法的最新研究进展。
3) Lead-free Solder Bump
无铅焊料凸点
5) Bumps
凸焊点
1.
The Research and Development of Vertical Fountain Plating for Making Bumps in Wafer Level Package;
制作圆片级封装凸焊点的垂直喷镀机研制
6) multiple projection welding
多点凸焊
补充资料：凸凸
1.高出貌。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条