1)  Sn-Cu solder
锡铜焊料
2)  tin-copper
锡铜
1.
This paper investigated the effects of high magnetic field on the growth behaviors of tin-copper intermetallic compounds (IMC) layers.
研究了强磁场对锡铜界面金属间化合物生长行为的影响,研究了Sn/Cu钎焊和扩散焊焊接界面处金属间化合物的生长行为,同时也研究了Sn-3Ag-0。
3)  Sn-Cu deposit
锡-铜矿床
4)  tin-copper alloy
锡铜合金
1.
A method to directly determine the tin in the plating bath for a novel acidic bright tin-copper alloy coating was established based on releasing back titration, which was aiming at eliminating the reference of Cu 2+ and preventing the Sn 2+ and Sn 4+ from hydrolysis.
为消除Cu2+的干扰,防止Sn2+,Sn4+的水解,建立了一套采用解蔽返滴定法,不经分离对新型酸性光亮镀锡铜合金镀液中的锡进行测定的分析方法。
2.
Minim copper in new acidic bright tin-copper alloy plating bath was determined by spectrophotometrie method using 2-(5-bromo-2-pyridylazo)-5-diethylaminophenol(5-Br-PADAP)as chromogenic reagent,and measuring wavelength was optimized.
采用 5 -Br -PADAP光度法测定酸性光亮镀锡铜合金液中的微量铜 ,优选出最佳测定波长。
3.
By sintering the tin-copper films electroplated from an alkaline solution under different temperatures, several kinds of the tin-copper alloy negative electrodes were prepared.
将碱性镀液中制备的锡-铜膜在不同温度下烧结,制得几种锡铜合金负极材料。
5)  Tin-copper ore
锡铜矿
6)  Sn-Cu alloy
锡-铜合金
参考词条
补充资料：锡铅合金焊料
分子式：
CAS号：

性质：工业上广泛使用的一种软钎焊料。加入铅可降低熔点，并与锡形成熔点仅183℃的共晶体。熔融法制备。含铅50％的焊料俗称二分焊料，强度高，结晶温度范围为183～214℃，是一种常用焊料。含铅38.1％(共晶成分)的焊料俗称三分焊料，其组织全部为共晶体，熔点仅183℃，在电工中得到广泛应用，又称为共晶焊料。

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