The basic definition of nanoelectronic packaging, which is becoming the core science and technology for the field of electronic manufacture in the 21 century, and the driving force caused by it are discussed .

Preparation of high volume fraction SiCp/Al composites for electronic packaging;

Study on properties of the environmental-friendly Sip/Al composites for electronic packaging applications;

Preparation of SiC particulate reinforced 356Al matrix composite for electronic packaging and its thermal expansion performance;

Based on ourselves' research activity and literature reports,evaluated and discussed the development trend of composite electronic package and substrate materials.

Development of advanced electronic package devices promoted the study on the reflow soldering.

Solder joints functioned as mechanical, thermal and electrical interconnections between electronic packages and the printed circuit board (PCB), their failure can lead to critical malfunction of electronic products directly.

Several silk materials including gold silk, copper silk and aluminum silk used as conductor in wire bonding technology in electronics packaging materials were introduced.

System In Packaging SIP is a brand-new technology of electronics packaging.

Fiber fixing process is critical tooptoelectronic packaging.