1) micro-cladding
微细熔覆
1.
In this paper, a new technology named laser micro-cladding technique is introduced, in which the metal-organic conductive pastes are used as the cladding materials, and the organic insulator resin .
结果表明 ,激光微细熔覆直写布线层与基材结合牢固 ,所布导线的电阻率与导电银颗粒的体积分数及激光功率的大小有关 ,工艺参数与材料配比合适时 ,导线电阻率可以达到 10 -6Ωcm的数量级 ,能够满足工业应用的要求。
2) laser micro-cladding
激光微细熔覆
1.
Establishment and application of temperature field model in laser micro-cladding;
激光微细熔覆温度场模型的构建与应用
2.
Structure and properties of thick-film capacitors fabricated by laser micro-cladding rapid prototype;
激光微细熔覆快速原型制造的厚膜电容组织性能
3.
Fabrication of thick film resistors by laser micro-cladding resistor pastes;
用激光微细熔覆法直写电阻浆料制备厚膜电阻
3) conductor fabrication by laser micro-cladding electronic pastes
激光微细熔覆柔性布线
4) micro-arc cladding
微弧熔覆
5) Laser micro-cladding
激光微熔覆
1.
A novel method to fabricate circuit board by laser micro-cladding technology was introduced in this paper.
介绍了一种利用激光制备线路板的新方法———激光微熔覆柔性布线技术 ,根据其原理和特点 ,设计并制造了相应的柔性布线系统 ,重点介绍了其软硬件组成。
6) circuit board fabrication by laser micro cladding
激光微熔覆布线
补充资料：熔盐电解法生产铌粉(见熔盐电解法生产钽粉)
熔盐电解法生产铌粉(见熔盐电解法生产钽粉)
production of niobium powder by molten salt electrolysis
rongyand+onjlefa ShengChan n.fen熔盐电解法生产妮粉(produetion。fn;obi-um powder by molten salt eleetrolysls)见熔盐电解法生产担粉。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条