1) Multi-depth microfluidic chip
多深宽芯片
2) UWB chipset
超宽带芯片
3) multi chip
多芯片
1.
This article gives an introduction to technology of a new type multi chip module,which is expected to solve the problems of interlock signal delay,cross talk noise,inductance /capacitive coupling and electromagnetic radiation caused by the traditional sealing and interlock technology in electronic syste
针对电子系统中由传统的封装与互连工艺引起的互连信号延迟、串扰噪声、电感／电容耦合以及电磁辐射等问题，介绍一种新型的多芯片组装技术（ＭｕｌｔｉＣｈｉｐＭｏｄｕｌｅ）。
2.
This paper describes the developments in MEMS packaging technologies,including single chip and multi chip packaging solutions.
介绍了 MEMS封装技术 ,包括单芯片和多芯片封装技术。
4) more LED chips
多芯片LED
1.
Hybrid integrated design of the more LED chips with gather constant current diode IC circuit;
多芯片LED与恒流源一体化混合集成设计
6) MCM
多芯片组件
1.
Research on the Failure Rate Prediction for MCM;
多芯片组件MCM的失效率预计研究
2.
Finite Element Simulation for 3-D Thermal Analysis of MCM;
多芯片组件的三维温场有限元模拟与分析
3.
MCM made by means of advanced thick film technology;
基于先进厚膜技术的多芯片组件
补充资料：外宽内深
1.谓外貌宽厚而实则城府很深。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条