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1)  Via self-heating
通孔自热
2)  bypass louver
旁通散热孔
3)  thermal natural ventilation
热压自然通风
1.
In this paper,for civil buildings with double heating sources and invariable indoor remaining heat,flow field of thermal natural ventilation was simulated under the conditions of different distances between two sources with the technique of CFD.
本文首先对具有双热源的民用建筑采用CFD技术,在室内余热量不变的条件下,改变双热源间距对热压自然通风流场进行了数值模拟。
2.
In thermal natural ventilation,buoyancy plumes derived from heating source make the thermal stratification indoors.
热压自然通风中,热源产生的浮力羽流使得室内存在热分层现象。
4)  through-hole
通孔
1.
Effect of Different Additives on the uniform Deposition of through-hole by Pulse Electroplating in Acidic Copper Plating Bath;
添加剂对脉冲酸性镀铜通孔均匀沉积的影响
2.
Preparation of self-standing,through-hole anodic alumina membranes by cathodic polarization method in a neutral KCl solution;
中性水溶液中阴极电解制备自支撑通孔氧化铝膜
3.
Applying the software of ANSYS,based on the flat plat specimen,the finite element analysis about the wear resistance of bionic non-smooth through-hole specimen was given.
利用ANSYS软件,以平板试件为对比基准,对具有仿生非光滑通孔结构试件的耐磨机制进行了有限元分析。
5)  via [英]['vaɪə]  [美]['vaɪə]
通孔
1.
Analysis and simulation of joule heat effect of interconnect via in integrate circuit;
集成电路互连铝通孔焦耳热效应的分析与模拟仿真
2.
Research progress in vertical via interconnect in microwave multi-chip module;
微波多芯片组件中垂直通孔互连的研究进展
3.
Simulation on Vertical Via Interconnect Using Matrix-Penciled Moment Method in Multi-Chip Module;
微波多芯片组件中垂直通孔互连的矩阵束矩量法仿真
6)  via hole
通孔
1.
A study on GaAs backside via hole etching technique;
GaAs背面通孔刻蚀技术研究
2.
The limitation of the theoretical formula was analyzed for calculating the inductance of column via hole.
分析了理论公式在计算截圆锥通孔电感中的局限性。
补充资料:自调自净自度
【自调自净自度】
 (术语)同自调项。
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