1) Printed Circuit Board encapsulation material
集成电路灌封材料
2) electrical equipment potting material
电器灌封材料
3) plastic packaged integrated circuit
塑料封装集成电路
4) encapsulating material
灌封材料
1.
Study on modified epoxy resin-encapsulating materials
改性环氧树脂灌封材料的研制
2.
Milled glass fiber (MG)/polyurethane (PU)/epoxy resin (EP) encapsulating material was prepared by vacuum priming.
采用真空灌注工艺,制备磨碎玻璃纤维(MG)／聚氨酯(PU)／环氧(EP)灌封材料,并对其力学性能和微观结构进行研究。
3.
Epoxy resin/nano-silica encapsulating materials were obtained from in situ polymerization, and microstructure and properties of the materials were investigated by transmission electron microscopy(TEM),scanning electron microscopy(SEM) and differential scanning calorimetry(DSC).
采用原位聚合法制备了环氧树脂/纳米S iO2灌封材料。
5) encapsulating materials
灌封材料
1.
Properties of Epoxy Encapsulating Materials;
环氧树脂灌封材料性能研究
2.
Study on synthesis and mechanics performance of encapsulating materials based on nano-SiO_2/epoxy resin
纳米SiO_2/环氧树脂灌封材料的制备和力学性能研究
3.
This paper mainly described the research on rheological property,high thermal stability,flame retardant,the influence of catalyst and insulating heat conduction of organic silicon encapsulating materials,which greatly apply on electronic equipment and large scale integrated circuit and so forth.
本文主要综述了国内外用于电子元器件、大规模集成电路等高科技领域的有机硅灌封材料在流动、耐高温、阻燃和绝缘导热等方面的性能以及催化剂对灌封材料的影响的研究应用进展。
6) Potting material
灌封材料
1.
The properties and typical applications of polyurethane isolate potting materials were reviewed.
介绍了聚氨酯绝缘灌封材料的性能特点及典型应用。
2.
This paper introduces the performances demands and the development of potting materials using in electronic equipment, and the sorts of potting materials.
本文介绍了灌封材料在电子器件封装中的作用、国内外的灌封材料的种类,指出了传统灌封材料的不足,及研制绝缘导热灌封材料的重要意义。
补充资料：BiCMOS集成电路