1) phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)
酚醛纸质覆铜箔板
2) phenolic paper copper bearing laminated material
酚醛纸质覆铜箔层压板
4) printed circuit board paper
覆铜箔板纸
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
5) epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)
环氧纸质覆铜箔板
6) printed circuit board
覆铜箔板
1.
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
介绍了覆铜箔板纸的用途,覆铜箔板的制造过程和应用。
2.
It has been demonstrated that the recycled particle from printed circuit board waste can be used as a filler aod reinforcement in thermoplastic PP, PE, PVC and thermosetting BMC.
本文介绍了覆铜箔板废料的回收处理路线,研究了其回收粒料对热塑性PP、PE、PVC和热固性 BMC填充和增强的作用。
补充资料：酚醛纸质覆铜箔层压板
分子式：
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
CAS号：
性质：由棉浆纸浸渍改性酚醛或阻燃性酚醛树脂经烘焙，单面覆以铜箔、热压、剪切而成。具有良好的介电性能、耐热性、冷冲孔性和自熄性，尺寸稳定性好，翘曲小，价格低廉。适用于电视机、收录机、家用电器中作印制电路板。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条