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1)  buried /blind via
埋/盲孔
2)  buried / blind via
埋盲孔
3)  blind hole
盲孔
1.
Applied formula of nickel eletroplating additive for deep and blind hole;
深孔盲孔镀镍添加剂应用配方探讨
2.
Discussion on estimating the blind hole during chemical grouting;
化灌中对盲孔判定问题的探讨
3.
Building blind hole structure analyzer of the oil perforating gun based on BP neural network;
基于BP神经网络建立石油射孔枪盲孔结构分析器
4)  Micro-pore
盲孔
1.
An opto-electronic inspection system based on the direct imagery theory is presented for non-contact observation of the micro-profile of a small area, especially that of the underside of a micro-pore.
针对微小面积,特别是微小"盲孔"底面形貌的非接触精密检测,提出了一种基于直接成像原理的光学结构。
5)  blind via
盲孔
1.
The investigation on the cracking morphology of the blind vias and chemical analysis on the grain boundary of copper - plating layers have definitely identified that inappropriate compositions of electroplating solution and sulfur segregation are the critical causes of the crack defect.
通过观察盲孔的开裂形貌、分析裂纹的化学成分,确认了镀液配比不当、硫等杂质元素偏析是引起开裂缺陷的关键起因,并首次提出了开裂的失效机制。
2.
Failure of blind via is one of the main causes of an open circuit in printed circuit board(PCB).
盲孔开裂是导致印制电路板(PCB)电气断路的主要原因之一。
6)  buried via hole
埋孔
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