1) SIP Packaging Technology
SIP封装工艺
2) packaging process
封装工艺
1.
The influences of white light LED packaging process on its performance are discussed in this paper.
通过理论分析与实验数据说明了白光LED封装工艺对其性能的影响,特别针对模粒卡位、胶体外形等进行较为详细的分析。
2.
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
3) Packaging technique
封装工艺
1.
The titanium alloy slice packaging technique for fiber Bragg grating(FBG) sensor was developed in consideration of bare optical fiber being fragility,and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied.
提出了一种光纤光栅(FBG)的Ti合金片的封装工艺,实验和理论研究了FBG的应变和温度传感特性。
2.
Presented is the scheme of packaging technique of the FBG with a compact structure by using the red copper slice.
研究了光纤布拉格光栅的封装及其布设工艺,以及封装后的传感理论,提出并实现了一种光纤布拉格光栅的封装工艺,即用导热性能良好的紫铜片对光纤布拉格光栅进行封装,这种封装结构简单小巧。
3.
The steel capillary packaging technique for fiber Bragg grating(FBG)sensor was developed in consideration of bare optical fiber being fragility,and the strain and temperature characteristics of the packaged FBG sensors were experimentally and theoretically studied on material mechanics multifunctional experimental platform and in constant temperature box.
提出了一种光纤光栅的毛细钢管封装工艺,并通过材料力学多功能实验台和恒温箱对其应变与温度传感特性进行了研究。
4) encapsulating technique
封装工艺
1.
In consideration of bare optical fiber being fragility, the steel capillary encapsulating technique for FBG sensor was developed in this study, and then the temperature and strain sensing properties of the encapsulated FBG sensor were experimentally studied on material test system and under hot water, respectively.
提出了一种光纤光栅 (FBG)的毛细钢管封装工艺 ,并通过材料试验和水浴法试验对其应变与温度传感特性进行了研究。
5) encapsulation technology
封装工艺
1.
Research on PV Module Encapsulation Technology of Building Integrated Photovoltaic(BIPV)System;
光伏建筑一体化系统中光伏组件封装工艺探讨
6) system-in-package(SiP)
系统级封装(SiP)
1.
In system-in-package(SiP) or system-on-package(SoP),the integrality of power distribution network(PDN)is required.
在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题。
补充资料：SI
有机硅树脂简称SI，是由三乙氧基硅烷等缩合而成。溶于乙醇、丁醇、醋酸乙酯、丙酮、苯、甲苯、环己酮等。预聚体在低温下能快速固化，固化后的树脂硬度高、耐热、耐磨、耐辐射、耐水、防潮、耐大气老化，低温(-50℃)不脆化。透明度高，可见光透光率90％以上。无毒。
用作酚醛树脂和环氧树脂剂的改性剂，可提高耐热性和耐水性贮存于阴凉、通风、干燥的库房内。
用作酚醛树脂和环氧树脂剂的改性剂，可提高耐热性和耐水性贮存于阴凉、通风、干燥的库房内。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条