3) flip chip attach (FCA)
倒装芯片贴装，倒装芯片附着
4) Surface Mount Device(SMD)
贴片封装
1.
All the packaging of its components are Surface Mount Device(SMD),and we use software to instead of some hardware circuits.
它所有的器件采用贴片封装,用软件来代替部分硬件电路。
5) Die Attach
芯片贴装
1.
Explore New Challenges of Wafer Level Die Attach Film for Wafer Preparation Process;
探索晶圆级芯片贴装薄膜和芯片制备集成工艺的新挑战(英文)
6) flip-chip
倒装片
1.
In the article experiment prove:combination with feine tin-solder-bumps and underbump-metalliza with cobalt be able to longthen life of leadless flip-chip-solderng.
文章通过试验证明:纯锡焊料凸块和含钴底部凸块金属焊层结合可延长无铅焊接倒装片的寿命。
补充资料：倒装
用颠倒词序来加强语气、协调音节或错综句法的修辞格。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条