1) quasi AP-injective module
拟AP-内射模
1.
We combined the known properties of quasi AP-injective modules with the way of studying quasi P-injective modules to give some new properties on quasi AP-injective module.
把拟AP-内射模的已有性质与拟P-内射模的研究方法相结合,给出了拟AP-内射模的一些新性质。
2) analog AP
模拟AP
1.
By integrating with the technology of IDS、Firewall、Access Control and Flux Statistic and using new encryption algorithm, the new fat analog AP has higher security performance comparing to the traditional one.
设计实现了一个胖无线接入点模拟AP,并引入了高效的加密算法。
3) AP-injective rings
AP-内射环
1.
In this paper,we mainly prove that right P-V′ and right AP-injective rings are left nonsingular and discuss the regularity of right nonsingular AP-injective rings.
主要证明了右P-V′、右AP-内射环是左非奇异的,并且研究了非奇异的AP-内射环的正则性。
2.
The purpose of this paper is to study the following two questions on AP-injective rings: (1) R is a regular ring if and only if R is a left PP-ring and R is left AP-injective; (2) Let R be a right .
本文的主要目的是讨论AP-内射环中的两个问题:(1)环R是正则的当且仅当R是左AP-内射的左PP-环;(2)如果R是左AP-内射环,那么R是内射环当且仅当R是弱内射环。
4) AP-injective ring
AP-内射环
1.
Some studies on AP-injective rings;
关于AP-内射环的某些研究
2.
Some relations about the generalizations of self-injective ring: P-injective ring, GP-injective ring, AP-injective ring, simple-injective ring and n-injective ring are studied.
我们研究了关于广义自内射环(P-内射环,GP-内射环,AP-内射环,单内射环,n-内射环)的一些关系。
5) quasi-injective modules
拟内射模
1.
In this paper the perfect rings and the hereditary rings are characterized with quasi-projective modules or quasi-injective modules.
完全环和遗传环可由投射模或内射模来加以刻画,利用一种较为简单的方法证明可以用拟投射模或拟内射模来刻画这些环。
2.
In this paper,we generalize the classical Schanuel s lemma to the situation of quasi-projective and quasi-injective modules.
把Schanuel引理推广到拟投射模和拟内射模的情形,进而导出半单模的一些新性质。
6) right AP-injective rings
右AP-内射环
补充资料：双酚AP型环氧树脂(bisphenol-AP type epoxy resin)
分子式：
CAS号：
性质：俗称双酚AP型环氧树脂(bisphenol-AP type epoxy resin)。分子链含有双酚AP结构的缩水甘油醚型环氧树脂。分子量540～640，软化温度100～120℃。固化物断裂伸长率5％～7％。玻纤增强塑料压缩强度392MPa，弯曲强度622.3MPa，剪切强度41.2MPa(150℃时2.94MPa)。由季戊四醇、丙烯醛和苯酚制成双酚AP后，再与环氧氯丙烷缩聚制得。加工方法与双酚A型环氧树脂相似。主要用作玻纤缠绕结构材料如高压容器等。
CAS号：
性质：俗称双酚AP型环氧树脂(bisphenol-AP type epoxy resin)。分子链含有双酚AP结构的缩水甘油醚型环氧树脂。分子量540～640，软化温度100～120℃。固化物断裂伸长率5％～7％。玻纤增强塑料压缩强度392MPa，弯曲强度622.3MPa，剪切强度41.2MPa(150℃时2.94MPa)。由季戊四醇、丙烯醛和苯酚制成双酚AP后，再与环氧氯丙烷缩聚制得。加工方法与双酚A型环氧树脂相似。主要用作玻纤缠绕结构材料如高压容器等。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条