1) tin coating
Sn镀层
1.
Welding failure analysis of tin coating for the terminal electrode of MLCC
MLCC端电极Sn镀层的焊接失效分析
2) pure Sn coating
纯Sn镀层
1.
Temperature cycling tests were executed to assess the reliability of pure Sn coating.
当器件经历500与1 000次温度循环后,纯Sn镀层表面会产生致密的热疲劳裂纹,伴随生长出许多锡须。
2.
In this study,some Cu leads with pure Sn coating in TO220 packaging were executed the temperature cycling(TC) tests to research their behaviors of whisker growth.
采用TO220封装的电子元件,研究了在温度循环条件下,元件Cu引脚上纯Sn镀层的Sn须生长行为。
3) Sn-Bi films
Sn-Bi镀层
1.
Sn-Bi films were electrodeposited on Cu substrate from a sulphate bath.
采用硫酸盐镀液在铜基体上电沉积Sn-Bi镀层,利用能谱仪(EDS)、扫描电子显微镜(SEM)和X射线衍射仪(XRD)研究了电沉积参数对镀层成分和微观结构的影响。
4) Cu Sn P Film Surface
Cu-Sn-P镀层表面
5) tin nickel alloy electroplate
Ni-Sn合金镀层
补充资料：[3-(aminosulfonyl)-4-chloro-N-(2.3-dihydro-2-methyl-1H-indol-1-yl)benzamide]
分子式：C16H16ClN3O3S
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
分子量：365.5
CAS号：26807-65-8
性质：暂无
制备方法：暂无
用途：用于轻、中度原发性高血压。
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条