1) Ag-Cu-Sn-In alloy
Ag-Cu-Sn-In合金
2) Sn-Ag-Cu alloy
Sn-Ag-Cu合金
1.
Studies on electrodeposition behavior of Sn-Ag-Cu alloy;
Sn-Ag-Cu合金电沉积行为的研究
2.
The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.
对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.
The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).
研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
3) Ag-Cu-In-Sn alloy
Ag-Cu-In-Sn合金
4) Ag-Cu-Ge-Sn alloy
Ag-Cu-Ge-Sn合金
5) Sn-Ag-Cu ternary alloy
Sn-Ag-Cu三元合金
1.
In this paper, electroplating processes and electrodeposit mechanism of lead-free Sn-Ag-Cu ternary alloy coatings from weak acid baths were studied.
本文研究了在弱酸性甲磺酸盐-碘化物体系中电沉积无铅可焊性Sn-Ag-Cu三元合金镀层工艺,并初步探讨了沉积机理。
6) Sn-Ag-Cu lead-free alloy
无铅合金Sn-Ag-Cu
补充资料：A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
A1-Cu-Co合金中十次对称准晶单晶体及其衍射图
‘ Al Cu—Co合金中十次对称准晶堕晶体e1)及其衍射圈(z) 中国科学盹垒禹研览听供稿
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
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