1) Sn-Ag-Cu-Bi alloy
Sn-Ag-Cu-Bi
2) Sn-Bi-Ag-Cu solder
Sn-Bi-Ag-Cu钎料
1.
Fillet-lifting mechanism for Sn-Bi-Ag-Cu solder joint in lead-free wave soldering;
无铅波峰焊Sn-Bi-Ag-Cu钎料焊点剥离机制
3) Sn-Ag-Cu series
Sn-Ag-Cu系
1.
Measurement of mechanical properties of Sn-Ag-Cu series lead-free solder alloy by using micro-indentation;
微观压痕法测量Sn-Ag-Cu系无铅钎料的力学性能
4) Sn-Ag-Cu alloy
Sn-Ag-Cu合金
1.
Studies on electrodeposition behavior of Sn-Ag-Cu alloy;
Sn-Ag-Cu合金电沉积行为的研究
2.
The electroplating process for Sn-Ag-Cu alloy coatings in weak acid bath is optimized.
对弱酸性甲磺酸盐-碘化物电镀Sn-Ag-Cu合金工艺进行了优化,镀层光亮、致密、平整,阴极电流效率提高到25%左右。
3.
The effect of the concentrations of main salts and the process conditions on the compositions,and the morphologies of Sn-Ag-Cu alloy electrodeposits were investigated by X-ray fluorescence(XRF) and scanning electron microscopy(SEM).
研究表明,Sn-Ag-Cu合金的电沉积是正则共沉积。
5) Sn-Ag-Cu solder
Sn-Ag-Cu钎料
6) Ag-Cu-Sn-In alloy
Ag-Cu-Sn-In合金
补充资料：(-)-2,3-O-Isopropylidene-sn-glycerol
分子式：C6H12O3
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
分子量：132.16
CAS号：14347-78-5
性质：密度1.062。沸点72-73°C (8 mmHg)。折射率1.433-1.435。闪点80°C。比旋光度-13.7° (neat)。水溶性miscible。
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参考词条