It is difficult to exposure the square unit phase structur es with sizes of several microns on diffraction patterns by using Gaussian focus s pot in a laser direct writing system.

Direct Writing (DW), a material-adding technology, is being researched more as a new method of PCB s manufacturing at home and abroad.

Optimization of S-curve intensity control model for laser direct writing;

Realization of electric control of laser direct writing mesh on concave spherical substrate;

Two beam interference laser direct writing technique for disk security;

In this paper, based on the technique of laser micro-fine cladding and flexibly direct writing, micro-fine conductive lines of high quality and high property are fabricated on glass substrates.

Focused spot shaping in laser writing system;