1) ultrasonic bonding
超声波键合
1.
Design and Fabrication of Micro Energy Director on Microfluidic Chip for Ultrasonic Bonding;
微流控芯片超声波键合能量引导微结构设计与工艺
2.
Ultrasonic Bonding System Applied to the Package of Polymer Micro Parts;
应用于聚合物微器件封装的超声波键合系统
3.
The USW of plastic used in the polymer MEMS packaging field forms a novel technology called ultrasonic bonding(USB).
为了解决当前聚合物MEMS器件键合技术中存在的问题,将塑料超声波焊接技术引入聚合物微器件键合领域,从而形成了一种新的MEMS键合工艺——超声波键合。
2) Ultrasonic fusion bonding
超声波熔融键合
1.
Ultrasonic fusion bonding has a high strength after welding, but how to design a reasonable welding joint for microfluidic chip to gain a successful bonding is a key problem.
经过超声波键合试验,分析和比较了两种键合微接头对聚合物微流控芯片超声波键合质量的影响,得出了超声波微流控芯片键合微接头合理设计的几点规律,这对今后聚合物MEMS超声波熔融键合微接头设计具有指导意义。
3) ultrasonic bonding
超声键合
1.
Experimental modeling on steady-state vibration of bonding tool in ultrasonic bonding;
超声键合装置中劈刀稳态振动的试验建模
2.
Development and prospect of ultrasonic bonding transducer;
超声键合换能器的研究——回顾与展望
3.
Study of nonlinear identification of time series of vibration on transducer in ultrasonic bonding system;
热超声键合换能系统动力学特性的非线性检验
4) ultrasonic wire bonding
超声键合
1.
Ultrasonic wire bonding is one of the most important technologies in chip interconnection of integrated circuits.
超声键合是实现集成电路封装中芯片互连的关键技术之一。
5) Ultrasonic Wire Bond
超声契键合
6) thermosonic bonding
热超声键合
1.
Dynamic characteristics study of piezoelectric transducer for thermosonic bonding;
热超声键合压电换能器的动力学特性
2.
The system of the ultrasonic transducer is the key component of the bonding equipment in the thermosonic bonding system.
在热超声键合系统中,超声换能系统是键合装备的核心部分。
补充资料：CLY-1型超声波在线粒度分析仪
CLY-1型超声波在线粒度分析仪
黔CLY一l型超声波在线粒度分析仪
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条