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1)  high-rank copper foil
高档铜箔
2)  top grade electrolytic copper foil
高精电解铜箔
1.
Using sodium stannate, zinc chloride and nickel chloride as main salts, copper was fractally electrodeposited on the surface of top grade electrolytic copper foil used for printed circuitry, then the Zn–Sn–Ni alloy was electrode- posited under alkaline condition.
采用锡酸钠、氯化锌、氯化镍做主盐,对印制电路用高精电解铜箔表面进行分形电沉积铜,再在碱性条件下电镀锌–锡–镍三元合金。
3)  A grade coated paper
高档铜版纸
1.
This article investigated the application of GCC in A grade coated paper and discussed the effect of the change of GCC and selection of suitable adhesive and additive on the properties of the coated paper.
对重质CaCO3(GCC)在高档铜版纸涂料中的应用进行了实验探索,讨论了配方中GCC的配比,GCC与胶粘剂及其它助剂的适应性。
4)  copper foil
铜箔
1.
The control of tension upon rolling-up in copper foil production;
铜箔生产的收卷张力控制
2.
Adhesion of polypropylene film and copper foil;
聚丙烯薄膜与铜箔的粘接
3.
Electroless nickel plating on PCB copper foil catalyzed by zinc solution;
锌溶液催化印制板铜箔化学镀镍
5)  copper foil
紫铜箔
1.
Analysis of common problems in alkaline tin plating on copper foil;
紫铜箔碱性镀锡常见问题浅析
2.
This paper examples some common breakdowns in production process of alkaline tin-plating for instance with copper foil.
以紫铜箔为例列举了碱性镀锡过程中出现的几种常见故障,分别对产生这些问题的原因进行了简要分析,并给出了相应的解决方法。
6)  brass foil
黄铜箔
1.
In order to investigate the size dependence of the plastic deformation properties for metal foil,uniaxial tensile tests of brass foil specimens with different thicknesses and grain sizes are performed at room temperature.
为了研究金属箔的塑性变形性能与尺寸的相关性,在常温下对不同厚度和晶粒尺寸的黄铜箔试样进行了单向拉伸实验。
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