2) plastic capsulation
塑料封装
1.
In the paper,resin material,the transfer molding mechanism,craft process and control as well as the mold of plastic capsulation of microelectronic components are analyzed and researched.
对微电子塑料封装所用树脂材料、树脂的传递、模塑成型机理、工艺过程及控制、塑料封装所采用的模具作了分析研究,将封装材料、工艺过程和模具设计三者紧密联系起来,为微电子塑料封装相关企业提供一个合理的参考依据。
3) plastic package
塑料封装
1.
The finite element analysis on moisture diffusion in microelectronic plastic packages during moisture preconditioning by using a commercial FEA software is studied and modeled.
塑料封装器件暴露在一定的潮湿环境下将会吸收潮湿的现象已经得到广泛的认同。
2.
A new kind of pulse laser on tunnel junction with plastic package is reported.
报道了一种新型塑料封装隧道结脉冲半导体激光器。
4) plastic drainage plate-based equipment
塑料排水板打设装备
1.
According to the construction characteristics on the ultra-soft clay foundation,the proposal of adopting a new generation of plastic drainage plate-based equipment was proposed.
针对超软粘土地基施工特点,提出新型塑料排水板打设装备的方案,该装备的开发对加快天津港吹填造陆进度具有重要意义。
5) charging equipment
装料设备
1.
According to the problems of WZ-C bell-less top charging equipment such as high temperature and perviousness of distributor.
针对高炉WZ-C无料钟炉顶装料设备存在的布料器温度高、透水等问题进行了原因分析,并进行水冷、水封系统改进。
6) SMD machine
SMD封装设备
补充资料：环氧塑料封装产品
环氧塑料封装产品
翻坛刁 获魏簇蕊}产吧竺i环‘塑\
说明：补充资料仅用于学习参考，请勿用于其它任何用途。
参考词条