说明:双击或选中下面任意单词,将显示该词的音标、读音、翻译等;选中中文或多个词,将显示翻译。
您的位置:首页 -> 词典 -> 高温无铅钎料
1)  high-temperature lead-free solder
高温无铅钎料
1.
People have to develop a new type of high-temperature lead-free solder to replace the high-lead solder in impendence in the electronic industry due to the harmfulness of Pb as well as its negative impact.
虽然在RoHS指令中含铅的质量分数超过85%的高熔点Sn-Pb钎料(如90Pb- 10Sn熔化温度268-301℃)因还没有找到合适的替代材料而得到豁免,但由于Pb的危害以及合金本身的负面影响,在电子工业中迫切需要研制新型高温无铅钎料来取代高铅钎料。
2.
The microstructure,joint shear strength and fracture surface of high-temperature lead-free solder Bi-xAg-0.
1Ge(x=2,5,8,11,14)高温无铅钎料/铜接头进行了界面微观组织分析、抗剪强度测试及剪切断口分析。
2)  high temperature lead-free solder
高温无铅钎料
1.
Research development of high temperature lead-free solders for electronic assembly
电子组装用高温无铅钎料的研究进展
2.
, silver powder sintering and solid-liquid diffusion, and offered a review on the research of several potential high temperature lead-free solders which included Zn and Bi-Ag based solders, Bi-based composite solders and Au-based solders.
在此基础上,探讨了高温无铅钎料及高温无铅互连技术的发展趋势。
3)  Lead-free Solder
无铅钎料
1.
Study of Sn-Zn Lead-free Solder by Alloying;
Sn-Zn无铅钎料合金化改性研究
2.
Study on interface and shear behavior in lead-free solder joint;
无铅钎料焊点界面与剪切行为的研究
3.
Rare earths modified Sn-58Bi low-temperature lead-free solders;
稀土改性的Sn-58Bi低温无铅钎料
4)  lead-free solders
无铅钎料
1.
Advances in research and application of lead-free solders for electronic and photonic packaging;
电子和光子封装无铅钎料的研究和应用进展
2.
Compared with the traditional “Bi-Segregation” invalidation mechanism, the“three-factor method” can explain the causes of lift-off formed or non-formed by all lead-free solders with and without bismuth.
相比传统的“Bi-Segregation”失效机理,“三要素法”可以解释含Bi和不含Bi的所有无铅钎料产生或不产生Lift-off的原因,并由此找出了Lift-off的抑制对策。
3.
Because of lead poisoning in Sn-Pb solder,it is necessary for our electronicmaterial industry to develop lead-free solders.
介绍了国外近年来在无铅钎料的研究开发领域取得的一些进展,内容包括:对无铅钎料的性能要求和研究试验方法;几种正在研究开发中的无铅钎料的成分与性能。
5)  lead free solder
无铅钎料
1.
Microstructure, wettability and mechanical properties of Sn-Zn-Cu lead free solder;
Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能
2.
With the development of electronic industry and the research of lead free solder, the requirement of high quality and low price lead free solder is urgent and the soldering reaction as well as the reliability of solder joints arouses researchers' attention.
随着电子工业的发展和无铅钎料研究的深入,对于高性能、低成本的无铅钎料的需求愈加迫切,而钎焊反应和焊点可靠性已成为当前研究的热点。
3.
After ten years study, researcher found that among all of the lead free solders, SnAgCu solder is the most possible solder to replace tin lead solder.
通过近十年的研发,研究者们发现:在众多无铅钎料中,SnAgCu钎料最有可能成为SnPb铅料的替代品。
6)  high lead-containing solder
高铅钎料
补充资料:高温
较高的温度,在不同的情况下所指的具体数值不同,例如在某些技术上指几千摄氏度以上,在工作场所指32摄氏度以上。
说明:补充资料仅用于学习参考,请勿用于其它任何用途。
参考词条