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1)  double side grinding
双端面磨削
1.
Because of the large aspect ratio of UC type inner ring,it is harder to guarrante the parallel deviation and the vetical deviation under the traditional technology,through the aid of toolings,using double side grinding process,the satisfactory effect is achived.
在工装辅助下,采取双端面磨削工艺,取得满意效果。
2)  face grinding
端面磨削
1.
In this paper, two types of resin bond diamond wheels with different grain size and concentration were applied in face grinding of two typical special ceramics.
本文采用不同粒度、不同浓度的树脂结合剂金刚石砂轮 ,对两种典型的特种陶瓷材料ZrO2 与Si3 N4 进行了端面磨削实验研究 ;通过在线监测磨削力和功率消耗 ,并结合加工表面的SEM微观分析 ,探讨了ZrO2 与Si3 N4 陶瓷表面的形成特征及材料的去除机理。
2.
An experimental research on face grinding of SiC particle-reinforced aluminium matrix composite 2024Al/SiCp with electroplated diamond grinding wheel was carried out.
用电镀金刚石砂轮对SiC颗粒增强铝基复合材料2024Al/SiCp进行了端面磨削实验研究。
3)  double-side grinding
双面磨削
1.
Using double-side grinding technology in 300 mm Si wafer manufacturing process,the Si wafer can obtain high accuracy surface parameters,and generate obvious grinding marks,which can affect the surface flatness.
在直径300mm Si片制备过程中,利用双面磨削技术能获得高精度的表面参数,但同时却会在Si片表面留下明显的磨削印痕,这会影响Si片表面平整度。
4)  face grinding device
端面磨削装置
5)  double-ended grinder
双端面磨床
1.
Analyzing characteristics of grinding zone during machining roller end with double-ended grinder;
双端面磨床加工滚子端面的磨削区特性分析
6)  Double disc surface grinding machines with vertical spindle
立轴双端面磨床
补充资料:双[1-(4-二甲氨基)苯基2-苯基1,2-二硫代乙烯合镍]
分子式:
CAS号:

性质:紫黑色单斜晶体。熔点277~278℃。溶于苯、甲苯、三氯甲烷等大多数有机溶剂。红外频率υ(C=S)1190、1165、1140cm-1,红外频率υ(S-C-C-S)880cm-1。由对二甲氨基安息香、五硫化二磷在二噁烷(二氧六环)中反应后,加入镍(Ⅱ)盐溶液制得。用作光学非线性材料。

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